ZQ1800 High-Precision Reballing Machine

This model is suitable for high-precision chip or motherboard reballing, wafer bumping, and other applications that require high repeatability in reballing processing industries. Specific application scope includes:

1. Support for BGA, QFN packaging, with the smallest ball diameter (Ball) at 0.2mm; the largest ball diameter is 1.27mm.
2. Various PCBA motherboards, requiring precise soldering on circuit boards, small motherboards, with the smallest size being 22MM, and the largest applicable size for objects being 220110MM.

The reballing machine platform uses imported dual-guide rails for repeated shifting operations and a high-precision electric lifting platform mechanism to ensure each positioning displacement is overlapped and accurate (error of 0.01mm). It controls the separation of the mold and stencil, with speed and stroke that can flexibly achieve various mold release methods. The quick-locking stencil screw facilitates the change of different specifications of stencils.

• Suitable for mass chip reballing.
• High positioning accuracy, with a repeat positioning accuracy of ±0.01mm; reballing accuracy of 0.015mm.
• PLC control can improve production efficiency, control quality, and save costs.
• Electric lifting platform for stencil positioning, semi-automatic ball dropping.