R880A High-Precision Automated Optical BGA Rework System

Functional Advantages:

  • The X and Y axes use motorized automatic control for movement, making alignment quick and convenient, and enabling the repair of oversized PCBs with no dead corners despite the relatively small footprint of the equipment.

Work Type:

  • Fully automatic optical alignment system.

Product Specifications:

  • Dimensions: L980×W710×H940mm.

Application Scope:

  • Suitable for the repair of various types of SMT components such as (BGA, QFN, PGA, POP, PLCC, TQFP, TSOP…).

Heating System:

  1. Equipped with an upper and lower three-zone independent temperature control heating system, including upper hot air heating, lower hot air mixed heating, and infrared preheating at the bottom.
  2. The large-size infrared heater uses high-performance imported heating tubes with a high-temperature microcrystal panel to ensure even PCB preheating.
  3. The infrared heating area can be electrically moved in the X direction, providing a more extensive and even preheating range, effectively preventing PCB warping.
  4. The upper heating head uses a dual-channel heater with an outlet diameter (not nozzle size) of up to 70mm, providing more uniform temperature for the repair of large-sized components and effectively improving the soldering success rate.

Optical Alignment System:

  1. High-precision optical alignment system with an HDMI 1080P microscope-grade ultra-high-definition CCD, electric X and Y direction movement, and full observation of components to eliminate “observation dead zones” and achieve precise component placement.
  2. The placement head can rotate in angle, controlled by micrometer adjustments, with a precision up to ±0.01mm.
  3. The placement head is controlled by a servo system to ensure accurate placement.
  4. Equipped with a laser dot positioning system for rapid conversion between different repair products without the need for complex parameter settings.

Operating System:

  1. The human-machine interface allows for various operation modes and custom operation permissions.
  2. Automatic soldering/uninstallation with simple operation.
  3. The human-machine interface uses a high-resolution touch screen.
  4. Multiple operation modes allow for one-click completion of chip desoldering and suction, with simple operation.
  5. Equipped with an automatic feeding system for automatic material feeding and collection.
  6. The X and Y axes have a new design, with the upper hot air heater able to move in the Y (front and back) direction and the infrared heating area able to move in the X (left and right) direction. During the repair process, there is no need to manually move the PCB board; it can be easily moved to the required repair position with joystick control, which is very convenient.

Safety System:

  1. The placement head has a built-in pressure detection device to protect the PCB and components.
  2. The placement head’s up and down motion system uses imported ball guide rails to ensure placement accuracy.
  3. The system automatically monitors each heater in real-time during operation and has an overheat protection function.
  4. The entire machine has an emergency stop function.

Equipment Advantages:

  1. Built-in automatic feeding and receiving system.
  2. The placement head can rotate in angle, controlled by micrometer adjustments, with a precision up to ±0.01mm.
  3. High-precision K-type sensors are used to accurately detect the temperature of each point on the PCB and BGA, with automatic curve analysis.
  4. Built-in vacuum pump with angle rotation for precise fine-tuning of the placement nozzle.
  5. The infrared heating system and PCB support plate can be electrically moved over a large range, facilitating the repair of large PCBs and multi-chip repairs.

Superior Safety Protection Features:

This machine is CE certified and equipped with an emergency stop switch and automatic power-off protection in case of accidents. It also has a microcrystal panel to prevent burns from falling objects or hands. An alarm function is available after soldering or desoldering is completed. In the event of temperature loss of control, the circuit can automatically cut off power, providing dual overheat protection. Temperature parameters are password protected to prevent arbitrary changes, and there are various safety protection and anti-idiot functions to ensure that repairs of PCBs and components are not damaged and the machine itself is not destroyed under any abnormal conditions.

Feature Specification
Power Supply AC Two-phase 220V 50/60Hz
Total Power Max 7600W
Heater Power Upper temperature zone 1200W, Lower temperature zone 1200W, IR zone 5000W
Temperature Control Closed-loop control with Omega K-type thermocouple, independent upper and lower temperature measurement, temperature accuracy up to ±1 degree
Positioning Method V-groove slot, universal fixture, infrared laser positioning
PCB Size Max 610×480mm, Min 6×6mm
Applicable Chips BGA, QFN, CSP, POP, QFN, QFP, LED, Micro SMD, etc.
Chip Size Max 100×100mm, Min 0.5×0.5mm
Upper Heater Nozzle Diameter 70mm (not the size of the air nozzle)
Outer Dimensions L980W710H940mm
Temperature Interface 5 ports
Machine Weight Approximately 140KG