H3900L Selective Wave Soldering Machine
Selective wave soldering typically consists of three modules: flux spraying, preheating, and soldering. Through the equipment’s programming device, the flux spraying module can selectively spray flux for each solder point on the board in sequence. After being preheated by the preheating module, the soldering module completes the soldering of each solder point one by one. The application scope of selective wave soldering is not limited to high soldering requirements and complex processes of multi-layer PCB through-hole soldering in military electronics, aerospace ship electronics, automotive electronics, digital cameras, printers, and so on. Selective wave soldering was invented as a special form of wave soldering to meet the development needs of through-hole component soldering.
- Integrated full-functionality machine, with three PCB boards or three fixtures simultaneously working in the spray, preheat, and soldering processes within the machine.
- Independent spray motion platform and independent soldering motion platform.
- High soldering quality, significantly improving the direct pass rate of soldering.
- SMEMA online transportation, supporting customers for flexible line assembly.
- Fully computer-controlled, parameters are set and saved on the computer. Configuration files are generated for easy traceability and storage.
- Software developed based on WINDOWS, with user-friendly and traceable operation.
- Direct use of PCB images for path programming, with settings available for path start point, soldering movement speed, Z-axis height, wave peak height, etc.
- Real-time display of the soldering process. The soldering process can be monitored through the camera feed to the display screen.
- Complete software monitoring of key parameters, such as temperature, speed, pressure, etc.
- Upgradable to automatic wave height correction function. It is possible to set how often to correct the wave height after a certain number of boards.
- Independently designed all-aluminum cast motion platform, with lightweight design that improves running speed while ensuring the rigidity of the platform.
Feature | Specification |
---|---|
Model | DEZ-H3900L |
Machine Dimensions | L3150 x W1680 x H1690mm |
Total Power | 20KW |
Power Supply | Three-phase, five-wire, 380V |
Power Line Requirement | 2.5² Copper Wire |
Air Source Requirement | 3-5kg/cm² |
Nitrogen Source Requirement | Purity: 99.999% |
Control System | Industrial PC + Controller PLC |
Soldering Area | L500 X W450MM |
PCB Transport Direction | Left to Right Horizontal Transport |
Motion Axes | X, Y |
Motion Control | Closed-loop Servo Control |
Positioning Accuracy | ± 0.05 mm |
Frame Type | Steel Welded |
Flux Capacity | 1L |
Preheating Method | Bottom Infrared Preheating, Top Hot Air Preheating |
Preheating Power | 6KW |
Melting Time | 45 Minutes (with programmable pre-heating) |
Maximum Soldering Pot Temperature | 350 °C |
Soldering Pot Power | 1.2KW |