H3630 Selective Wave Soldering Machine
Selective wave soldering machine typically consists of three modules: flux application, preheating, and soldering. Through the equipment’s programming device, the flux application module selectively applies flux to each solder pad in sequence. After preheating in the preheating module, the soldering module then completes the soldering of each pad one by one. The application range of selective wave soldering is not limited to: military electronics, aerospace and ship electronics, automotive electronics, digital cameras, printers, and other high soldering requirements and complex multi-layer PCB through-hole soldering processes. Selective wave soldering was invented as a special form of wave soldering to meet the development needs of through-hole component soldering.
- A fully functional offline model with a compact footprint.
- PCB board movement with a fixed spray and soldering platform for high soldering quality.
- Can be placed next to the production line for flexible line formation during soldering work.
- Fully computer-controlled, with parameters set and saved on the computer. Configuration files are generated for easy traceability and preservation.
- Software developed based on Windows 7, offering user-friendly and traceable operations.
- Direct path programming using PCB images, with settings for path start point, soldering movement speed, idle travel speed, Z-axis height, and wave height all adjustable on the computer.
- Real-time display of the soldering process, viewable through a camera feed to a display screen.
- Complete software monitoring of key parameters such as temperature, speed, and pressure.
- Upgradable to an automatic wave height correction function, with the ability to set intervals for wave height correction after a certain number of boards.
- Comprehensive LOG function, with three levels of machine access, each with different permissions. Complete records of machine operations and alarms.
Specification | Description (English) |
---|---|
Model | DEZ-H3630 |
Machine Dimensions | L1150mm X W1260mm X H850mm (excluding base) |
Total Power Consumption | 5KW |
Power Supply | Single phase 220V 50HZ |
Power Cable Requirement | 2.5mm² copper wire |
Air Source Requirement | 3-5kg/cm² |
Nitrogen Source Requirement | Nitrogen purity requirement: 99.999% |
Control System | Industrial PC |
Soldering Area | 300X300MM |
PCB Placement Method | Manual placement |
Motion Axes | X, Y, Z |
Motion Control | Panasonic closed-loop servo control |
Positioning Accuracy | ± 0.05 mm |
Frame Type | Steel base frame welding |
Flux Capacity | 2L |
Preheating Method | Halogen lamp |
Preheating Power | 5KW |
Melting Time | 45 Minutes (with programmable pre-heating) |
Maximum Solder Pot Temperature | 350 °C |
Solder Pot Power | 1.2KW |