H3200 Selective Wave Soldering Machine

The H3200 adopts lead-free soldering and uses optical recognition system, control system and computer software to complete the automated production technology of the soldering process. This technology is suitable for mounting microelectronic components on smaller circuit boards.

  • Fully functional offline model, compact footprint.
  • PCB board movement, spray, and soldering platform fixed. High soldering quality.
  • Can be placed beside the production line for soldering work, offering considerable wiring flexibility.
  • Fully computer-controlled, all parameters set and saved on the computer. Generates configuration files for easy traceability and storage.
  • Software functionality based on WINDOWS 7 development, with user-friendly operation and good traceability.
  • Direct PCB image usage for path programming, with starting point, soldering speed, Z-axis height, wave height, etc., all adjustable on the computer.
  • Real-time display of soldering process. Observed via camera feed to the display screen.
  • Full software monitoring of key parameters such as temperature, speed, pressure, etc.
  • Upgradeable to automatic wave height calibration function. Set intervals for wave height calibration per number of boards.
  • Comprehensive LOG function, with three levels of machine access, each with different permissions. Complete records of machine operations and alarms.
  • Lightweight motion platform design, enhancing operating speed while ensuring platform rigidity.
  • Servo motors and stepper motors provide motion power, with ball screws, synchronous belts, and linear guides for precise positioning, low noise, and smooth movement.

1. How long is the warranty for your equipment? How is the after-sales service?
A:We provide a 1-2 year warranty (depending on the model). We will provide equipment training and detailed operation manuals to ensure that customers can use the equipment correctly. In addition, we provide regular after-sales service and technical support to help customers solve any problems encountered during use.

2.How is the soldering accuracy of your equipment?
A:Our selective wave soldering machine can provide high-precision soldering under the conditions of setting parameters on the PC side, especially when dealing with small components and high-density circuit boards, which can ensure the quality and consistency of solder joints.

3.What type of PCB boards are suitable for your selective wave soldering machine?
A:Our selective wave soldering machine is especially suitable for high-density PCB boards with complex components (such as BGA, QFN, etc.), multi-layer, double-sided assembly. It can precisely control the soldering area to avoid waste and soldering errors.

4.Is your equipment maintenance and cleaning complicated?
A:Our equipment needs regular cleaning and maintenance, especially the crest part, to ensure its stability and long-term performance. With correct operation and regular maintenance, the service life of the equipment can be extended.

5.How efficient are your equipment?
A:Our selective wave soldering machines are highly efficient and suitable for small batch and high mix production environments, but the soldering speed and efficiency will be affected by the complexity of the PCB board and the size of the soldering area.

Featured Specs

Machine modelDEZ-H3200
dimensionL1150mm X W795mm X H1550mm(Without base)
general power3kw
Operating power1kw
power supplySimplex 220V 50HZ
net weightAbout 300KG
Air source pressure requirements3-5 Bars
Air source flow requirements8-12L/min
Nitrogen source pressure requirements3-4 Bars
Nitrogen source flow requirementsMore than 2 cubic meters per hour
Nitrogen source purity requirements≥99.998%
FixtureCan be used as needed
max solder areaL300 X W250MM (Customizable size)
PCB thickness0.2mm~6mm
pcb edge≥3mm
Controlling systemIndustrial PC
Loading boardManual
Unloading boardManual
Operating height700+/-30mm
PCB conveyor up clearanceNot limited
PCB conveyor bottom clearance30MM
motion axisX, Y, Z
motion controlServo + stepper
position accuracy±0.1 mm
chassisSteel structure welding
Flux management
flux nozzlejet valve
flux tank capacity1L
flux tankFlux Box
solder pot
standard pot1
solder pot capacity15 kgs /pot
solder temperature rangePID
melting time30--40 Minutes
max solder temperature350℃
Tin tank power1.2kw
solder nozzle
wave soldering nozzleCustomized shapes
Tin nozzle materialalloy steel
standard equipped nozzle5 pcs/furnace(Inner diameter 4mm x 3pcs,5mm,6mm )
Nitrogen ManagementYes
Nitrogen PID Control0 - 350 ℃
Nitrogen consumption/tin nozzle1~2m³/hour/nozzle