H3200 Selective Wave Soldering Machine
The H3200 adopts lead-free soldering and uses optical recognition system, control system and computer software to complete the automated production technology of the soldering process. This technology is suitable for mounting microelectronic components on smaller circuit boards.
- Fully functional offline model, compact footprint.
- PCB board movement, spray, and soldering platform fixed. High soldering quality.
- Can be placed beside the production line for soldering work, offering considerable wiring flexibility.
- Fully computer-controlled, all parameters set and saved on the computer. Generates configuration files for easy traceability and storage.
- Software functionality based on WINDOWS 7 development, with user-friendly operation and good traceability.
- Direct PCB image usage for path programming, with starting point, soldering speed, Z-axis height, wave height, etc., all adjustable on the computer.
- Real-time display of soldering process. Observed via camera feed to the display screen.
- Full software monitoring of key parameters such as temperature, speed, pressure, etc.
- Upgradeable to automatic wave height calibration function. Set intervals for wave height calibration per number of boards.
- Comprehensive LOG function, with three levels of machine access, each with different permissions. Complete records of machine operations and alarms.
- Lightweight motion platform design, enhancing operating speed while ensuring platform rigidity.
- Servo motors and stepper motors provide motion power, with ball screws, synchronous belts, and linear guides for precise positioning, low noise, and smooth movement.
H3200 Brochure ()
Featured Specs
| Model | H3200 |
|---|---|
| Device Name | Selective Wave Soldering Machine |
| Machine Size | L1100mm X W790mm X H1500mm (excluding base) |
| Total Power | 3KW |
| Power Supply | Single-phase 220V 50HZ |
| Power Supply Requirement | 2.5² copper wire |
| Air Supply Requirement | 3-5kg/cm² |
| Nitrogen Supply Requirement | Nitrogen purity requirement: 99.999% |
| Welding Area | 300X250MM |
| Board Placement | Manual placement |
| Motion Axis | X, Y, Z |
| Motion Control | Servo + Stepper |
| Positioning Accuracy | +/- 0.1 mm |
| Frame Type | Steel structure welding |
| Flux Capacity | 1L |
| Melting Time | 45 Minutes (can be preheated with timer) |
| Maximum Soldering Furnace Temperature | 350°C |
| Solder Pot Power | 1.2KW |
