Overview
Automatic model SMD / BGA Rework Stations support printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Min. 5mm * 5mm IC.
The ST-R850 BGA Rework Station
- High automatic rework
- Stable Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Infrared Pre-heater
- HD Touch Screen HMI Interface
- Automatic placement and desoldering
- More modular panels observation point setting
- Real-time temperature monitoring and over heating protection.
- Emergency Stop Button
- Rework Process Camera(Optional)
| Model | ST-R850 |
|---|---|
| Total power | 6800W |
| Upper heating power | 1200W |
| Bottom heating power | 1200W |
| Bottom IR heating power | 4200W（2400W is controlled） |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Location way | Optical camera+ V-shape card slot + laser position for fast location |
| Temperature control | High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision |
| Appliance selection | High sensitive touch screen + temperature control mode +Panasonic PLC +step driver |
| Max. PCB size | 570×450mm |
| Min. PCB size | 10×10mm |
| Sensor | 4units |
| Chip amplification multiple | 2-30X |
| PCB thickness | 0.5-8mm |
| Chip size | 0.3*0.6mm-80*80mm |
| Min. chip space | 0.15mm |
| Max. mount loading | 200g |
| Mount precision | ±0.01mm |
| Overall size | L670×W780×H850mm |
| Machine weight | 90KG |
- Rework Process Inspection Camera
