Overview

Semi-automated rework system  for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc.

The ST-R820 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 2mm * 2mm IC.

  1. Stable and Uniform Hot Air Heating System
  2. Lower Heater Adjustable
  3. Carbon Fiber Infrared Pre-heater
  4. High-Precision PID Temperature Control System
  5. Industrial High-Definition CCD Camera(1.3MP)
  6. High-Precision Optical Alignment System
  7. High-Resolution Touch Screen HMI Interface
  8. Automatic Placement, Desoldering
  9. Built-In Pressure Sensor System To Protects The PCB
  10. Real-Time Temperature Monitoring and Over-Temperature Protection.
  11. Emergency Stop Button
ItemST-R820
Overall Power5300W
Top heater1200W
Bottom heater1200W
IR heater2700W
IR Heating Area280*380mm
VoltageAC220V±10% 50/60Hz
Motion DirectionZ Axis
Temperature controlK-type Closed Loop thermocouple with accuracy
within ±3 ℃
temperature precision±3 degree
PCB sizeMax 415*370 mm Min 65*65 mm
Optical systemJapanese original high-definition CCD color imaging
BGA chipMax 80*80mm Min 2*2 mm
DimensionL680*W630*H900 mm (LCD stand not included)
Net weight79KG
PackingL780*W800*H1090mm
Gross Weight105KG
  • Rework Process Inspection Camera