Overview
entry level rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support chips size Max. 80mm x 80mm, Min. 3mm * 3mm. PCB motherboard Max. 620mm x 520mm
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable(Height Moving Range 3CM)
- Ceramic honeycomb Infrared Preheater(Left/ Right Moving Range 30 CM)
- High-Precision PID Temperature Control System(5 K-type sensor, 10 temperature zone control )
- High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- Emergency Stop Function
| Item | ST-R610 |
|---|---|
| Total Power | 4800W |
| Upper Heating Power | 800W |
| Lower Heating Power | 1200W |
| Infrared Heating Power | 2700W(1200W is controlled) |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Location way | V-shape card slot + Universal jigs |
| Temperature Controlling | K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree |
| Electrical Material | Touch screen + Temperature control module + PLC control |
| Max PCB size | 470*370mm |
| Min PCB size | 10*10mm |
| Sensor | 1 unit |
| PCB Thickness | 0.3-5mm |
| Suitable Chip Size | 2*2mm-60*60mm |
| Machine Size | 500*590*650mm |
| Weight | 40KG |
- Rework Process Inspection Camera
