Automatic solder paste printing machine

The product features a high-definition touch screen human-machine interface that displays real-time data in high clarity, equipped with an industrial 5-inch display for more convenient operation. It has a quick positioning induction switch and a locking device, making it easy to install and replace. It can store setting parameters and remember the positions of different BGA chip templates, and parameters can be set and corrected at any time on the touch screen. Additionally, the machine does not rely on external devices (computers) and can download, print, save, and analyze programs through its own USB port.

• Equipped with a Mitsubishi industrial control system, it offers diverse and fast motion control functions, stable performance, and simple and clear operation, with one-click operation suitable for mass solder printing work.
• High positioning accuracy, with a repeat positioning accuracy of ±0.012mm; printing accuracy of 0.015mm.
• PLC control can improve production efficiency, control quality, and save costs: electric lifting platform for stencil positioning; semi-automatic printing.
• Imported electric lifting platform controls the separation of the mold and the stencil, allowing for flexible speed and travel to achieve various mold release methods.
• One-piece fixture fixing positioning system, stencil positioning is convenient, fast, and accurate.
• Chip thickness can be adjusted with an electric platform.
• Can store setting parameters and remember the positions of different BGA chip templates.
• Multifunctional and user-friendly operating system.