H3200 Máquina de soldadura por ola selectiva
The H3200 adopts lead-free soldering and uses optical recognition system, control system and computer software to complete the automated production technology of the soldering process. This technology is suitable for mounting microelectronic components on smaller circuit boards.
- Modelo offline totalmente funcional, tamaño compacto.
- Movimiento de la placa de circuito impreso, pulverización y plataforma de soldadura fija. Alta calidad de soldadura.
- Puede colocarse junto a la línea de producción para realizar trabajos de soldadura, lo que ofrece una gran flexibilidad de cableado.
- Totalmente controlada por ordenador, todos los parámetros se configuran y guardan en el ordenador. Genera archivos de configuración para facilitar la trazabilidad y el almacenamiento.
- Funcionalidad del software basada en el desarrollo de WINDOWS 7, con un manejo sencillo y una buena trazabilidad.
- Utilización directa de imágenes de PCB para la programación de trayectorias, con punto de inicio, velocidad de soldadura, altura del eje Z, altura de onda, etc., todo ello ajustable en el ordenador.
- Visualización en tiempo real del proceso de soldadura. Observación a través de la alimentación de la cámara a la pantalla de visualización.
- Supervisión completa por software de parámetros clave como temperatura, velocidad, presión, etc.
- Actualizable a la función de calibración automática de la altura de las olas. Establece intervalos para la calibración de la altura de las olas por número de tablas.
- Completa función LOG, con tres niveles de acceso a la máquina, cada uno con diferentes permisos. Registros completos de las operaciones y alarmas de la máquina.
- Diseño ligero de la plataforma de movimiento, que mejora la velocidad de funcionamiento al tiempo que garantiza la rigidez de la plataforma.
- Los servomotores y motores paso a paso proporcionan potencia de movimiento, con husillos de bolas, correas síncronas y guías lineales para un posicionamiento preciso, poco ruido y movimiento suave.
1. How long is the warranty for your equipment? How is the after-sales service?
A:We provide a 1-2 year warranty (depending on the model). We will provide equipment training and detailed operation manuals to ensure that customers can use the equipment correctly. In addition, we provide regular after-sales service and technical support to help customers solve any problems encountered during use.
2.How is the soldering accuracy of your equipment?
A:Our selective wave soldering machine can provide high-precision soldering under the conditions of setting parameters on the PC side, especially when dealing with small components and high-density circuit boards, which can ensure the quality and consistency of solder joints.
3.What type of PCB boards are suitable for your selective wave soldering machine?
A:Our selective wave soldering machine is especially suitable for high-density PCB boards with complex components (such as BGA, QFN, etc.), multi-layer, double-sided assembly. It can precisely control the soldering area to avoid waste and soldering errors.
4.Is your equipment maintenance and cleaning complicated?
A:Our equipment needs regular cleaning and maintenance, especially the crest part, to ensure its stability and long-term performance. With correct operation and regular maintenance, the service life of the equipment can be extended.
5.How efficient are your equipment?
A:Our selective wave soldering machines are highly efficient and suitable for small batch and high mix production environments, but the soldering speed and efficiency will be affected by the complexity of the PCB board and the size of the soldering area.
Especificaciones destacadas
Machine model | DEZ-H3200 |
---|---|
dimension | L1150mm X W795mm X H1550mm(Without base) |
general power | 3kw |
Operating power | 1kw |
suministro eléctrico | Simplex 220V 50HZ |
net weight | About 300KG |
Air source pressure requirements | 3-5 Bars |
Air source flow requirements | 8-12L/min |
Nitrogen source pressure requirements | 3-4 Bars |
Nitrogen source flow requirements | More than 2 cubic meters per hour |
Nitrogen source purity requirements | ≥99.998% |
Fixture | Can be used as needed |
max solder area | L300 X W250MM (Customizable size) |
Grosor de la placa de circuito impreso | 0.2mm~6mm |
pcb edge | ≥3mm |
Controlling system | PC industrial |
Loading board | Manual |
Unloading board | Manual |
Operating height | 700+/-30mm |
PCB conveyor up clearance | Not limited |
PCB conveyor bottom clearance | 30MM |
motion axis | X, Y, Z |
motion control | Servo + stepper |
position accuracy | ±0.1 mm |
chassis | Soldadura de estructuras de acero |
Flux management | |
flux nozzle | jet valve |
flux tank capacity | 1L |
flux tank | Flux Box |
solder pot | |
standard pot | 1 |
solder pot capacity | 15 kgs /pot |
solder temperature range | PID |
melting time | 30--40 Minutes |
max solder temperature | 350℃ |
Tin tank power | 1.2kw |
solder nozzle | |
wave soldering nozzle | Customized shapes |
Tin nozzle material | alloy steel |
standard equipped nozzle | 5 pcs/furnace(Inner diameter 4mm x 3pcs,5mm,6mm ) |
Nitrogen Management | Yes |
Nitrogen PID Control | 0 - 350 ℃ |
Nitrogen consumption/tin nozzle | 1~2m³/hour/nozzle |