ZQ1800S High-Precision Semi-Automatic Reballing Machine

This model is suitable for high-precision chip or motherboard reballing, such as wafer reballing, and can be applied to industries requiring high repeatability in reballing processing. Specific application scope:

1. Supports BGA, QFN packaging, with the smallest ball diameter (Ball) at 0.2mm; the largest ball diameter is 1.27mm.
2. Various PCBA motherboards, requiring precision soldering on the circuit board, small motherboards, with the smallest size of 22MM, and the largest applicable size for 220110 objects. The reballing machine uses imported dual guide rails for repeated shifting operations, high-precision electric lifting platform mechanism, ensuring each positioning displacement is overlapping and accurate (error of 0.01mm) to control the separation of the mold and the stencil, with flexible speed and travel to achieve various mold release methods. Quick locking stencil screws facilitate the replacement of different specifications of stencils.

Product Features:

● Suitable for mass chip reballing.

● High positioning accuracy, with a repeat positioning accuracy of ±0.01mm; reballing accuracy of 0.015mm.

● PLC control can improve production efficiency, control quality, and save costs.

● Electric lifting platform for stencil positioning, semi-automatic ball dropping.