Overview entry level rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support chips size Max. 80mm x 80mm, Min. 3mm * 3mm. PCB motherboard Max. 620mm x 520mm FeaturesSpecificationOptional PartsGet a QuoteFeatures Stable and Uniform Hot Air Heating System Lower Heater Adjustable(Height Moving Range 3CM) Ceramic honeycomb Infrared Preheater(Left/ Right Moving…
Overview Automatic model SMD / BGA Rework Stations support printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Min. 5mm * 5mm IC. FeaturesSpecificationOptional PartsGet a QuoteFeatures The ST-R850 BGA Rework Station High automatic rework Stable Hot Air Heating System Lower Heater Adjustable Carbon Fiber Infrared Pre-heater HD Touch Screen HMI…
Overview Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. FeaturesSpecificationOptional PartsGet a QuoteFeatures The ST-R820 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 2mm * 2mm IC. Stable…
Overview Semi-automated ACF COF Bonding Machine for LCD Tab, COF IC, Flexible Cable bonding. FeaturesSpecificationOptional PartsGet a QuoteFeatures LCD Flex-Cable COF ACF Bonding Machine – for COF/TAB Repair 1, PLC control, pulse heating mode, combined with titanium alloy extrusion head, rapid heating and rapid cooling, can be set up four heating, accurate temperature control. 2, 5.7…
