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ZQ1800S ماكينة إعادة رقاقة BGA شبه الأوتوماتيكية عالية الدقة BGA شبه الأوتوماتيكية

ماكينة إعادة توصيل BGA

ZQ1800S High-Precision Semi-Automatic Reballing Machine FeaturesSpecificationGet a QuoteFeatures This model is suitable for high-precision chip or motherboard reballing, such as wafer reballing, and can be applied to industries requiring high repeatability in reballing processing. Specific application scope: Supports BGA, QFN packaging, with the smallest ball diameter (Ball) at 0.2mm; the largest ball diameter is 1.27mm.…

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ماكينة إعادة توصيل رقاقة BGA مع تحكم عالي الدقة وشاشة تعمل باللمس

ماكينة إعادة توصيل BGA

Automatic solder paste printing machine FeaturesSpecificationGet a QuoteFeatures The product features a high-definition touch screen human-machine interface that displays real-time data in high clarity, equipped with an industrial 5-inch display for more convenient operation. It has a quick positioning induction switch and a locking device, making it easy to install and replace. It can store…

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ماكينة إعادة توصيل BGA عالية الدقة ZQ1800 عالية الدقة

ماكينة إعادة توصيل BGA

ZQ1800 High-Precision Reballing Machine FeaturesSpecificationGet a QuoteFeatures This model is suitable for high-precision chip or motherboard reballing, wafer bumping, and other applications that require high repeatability in reballing processing industries. Specific application scope includes: Support for BGA, QFN packaging, with the smallest ball diameter (Ball) at 0.2mm; the largest ball diameter is 1.27mm. Various PCBA…