ZQ1800S ماكينة إعادة رقاقة BGA شبه الأوتوماتيكية عالية الدقة BGA شبه الأوتوماتيكية
ZQ1800S High-Precision Semi-Automatic Reballing Machine FeaturesSpecificationGet a QuoteFeatures This model is suitable for high-precision chip or motherboard reballing, such as wafer reballing, and can be applied to industries requiring high repeatability in reballing processing. Specific application scope: Supports BGA, QFN packaging, with the smallest ball diameter (Ball) at 0.2mm; the largest ball diameter is 1.27mm.…